From high-TC single-crystal substrates to polycrystalline wafers, diamond–copper materials and ultra-thin diamond films—engineered around the thermal path of the device.
From high-thermal-conductivity single-crystal diamond to large-area polycrystalline wafers, diamond-copper structures and transferable ultra-thin diamond films, Nova provides material platforms and integration solutions for demanding thermal-management applications.
High-thermal-conductivity single-crystal diamond for GaN/SiC power electronics, RF, laser and compact high-heat-flux systems.
Large-format polycrystalline diamond for wafer-level heat spreading, high-power GaN/SiC, RF modules and laser-diode thermal management.
Diamond–copper composites and metallized diamond bonded to copper structures for practical device packaging, machining and high-efficiency heat extraction.
Ultra-thin MPCVD diamond films grown on silicon, with controlled release and delamination to obtain transferable, flexible diamond membranes for chip thermal management and heterogeneous device integration.
Real thermal performance depends on contact quality, metallization, bonding, packaging geometry and interface resistance. Nova can work from diamond material selection through metallization and bonding to the final integrated thermal structure.
Nova Crystal supplies single-crystal diamond heat spreaders, polycrystalline diamond wafers, diamond–copper thermal materials and ultra-thin diamond films. Single-crystal diamond can reach thermal conductivity up to 2200 W/m·K, while large-format polycrystalline diamond supports wafer-level integration. Diamond–copper structures provide a practical combination of heat spreading, electrical conductivity and machinability.
For ultra-thin integration, Nova provides MPCVD diamond films grown on silicon with controlled delamination/release. The released diamond layer can form a transferable, flexible membrane, allowing the high-thermal-conductivity film to be integrated closer to the active device region. Nova also supports metallization, patterned metal layers, through-holes, bonding and custom thermal-module design for complete heat-flow solutions.
Contact Nova for thermal product brochures, available dimensions, metallization stacks, bonding structures, thermal characterization data and project-specific engineering discussion.
